التحكم في عملية SMT

Statistical process control monitors CpK for critical parameters: Solder volume (CpK>1.33), placement accuracy (±25μm). Real-time SPC dashboards trigger alerts for 6σ deviations. MES integration enables closed-loop corrections. Key metrics: First-pass yield >99.95 ٪ ، DPMO<200. ISO 9001:2015 compliance requires full traceability.