فحص معجون لحام

SPI systems use 3D laser scanning to measure solder paste volume, height, and area. Critical for preventing defects like bridging or insufficient solder before reflow. Advanced SPI machines achieve 10μm resolution with 0.98% measurement repeatability. Algorithms analyze paste deposition against J-STD-005 standards. In-line SPI reduces rework costs by 40% by flagging stencil clogging or squeegee pressure issues. Dual-lane SPI handles 20,000+ components/hour. Challenges include reflective surface errors, solved by multi-angle imaging. Industry 4.0 integration enables real-time feedback to printers. Key metrics: CpK >1 . 33 لقدرة العملية.